RT Conference Proceedings
T1 An efficient bond model for particle adhesion simulation in advanced manufacturing
A1 Quintana Ruíz, Osvaldo
A1 Campello, Eduardo
AB The aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes proper adhesion between particles requires certain stability requirements to be satisfied. Conversely, erroneous agglomeration resulting from particle adhesion may affect the particle-size spatial distribution and thereby compromise the mechanical properties of the manufactured piece.
YR 2020
FD 2020
LK http://hdl.handle.net/20.500.14066/2975
UL http://hdl.handle.net/20.500.14066/2975
LA eng
NO CONACYT – Consejo Nacional de Ciencia y Tecnología
DS MINDS@UW
RD 24-nov-2024