TY  - CPAPER 
AU  - Quintana Ruíz, Osvaldo
AU  - Campello, Eduardo
PY  - 2020
UR  - http://hdl.handle.net/20.500.14066/2975
AB  - The aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes...
LA  - eng
KW  - 6 Producción y tecnología industrial
KW  - PARTICLES
KW  - BOND MODEL
KW  - ADHESION
KW  - ADDITIVE MANUFACTURING
KW  - DISCRETE ELEMENT METHODS (DEM)
TI  - An efficient bond model for particle adhesion simulation in advanced manufacturing
ER  -