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An efficient bond model for particle adhesion simulation in advanced manufacturing

dc.contributor.authorQuintana Ruíz, Osvaldo
dc.contributor.authorCampello, Eduardo
dc.date.accessioned2022-04-21T01:54:08Z
dc.date.available2022-04-21T01:54:08Z
dc.date.issued2020
dc.identifier.urihttp://hdl.handle.net/20.500.14066/2975
dc.description.abstractThe aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes proper adhesion between particles requires certain stability requirements to be satisfied. Conversely, erroneous agglomeration resulting from particle adhesion may affect the particle-size spatial distribution and thereby compromise the mechanical properties of the manufactured piece.es
dc.description.sponsorshipCONACYT – Consejo Nacional de Ciencia y Tecnologíaes
dc.language.isoenges
dc.subject.classification6 Producción y tecnología industriales
dc.subject.otherPARTICLESes
dc.subject.otherBOND MODELes
dc.subject.otherADHESIONes
dc.subject.otherADDITIVE MANUFACTURINGes
dc.subject.otherDISCRETE ELEMENT METHODS (DEM)es
dc.titleAn efficient bond model for particle adhesion simulation in advanced manufacturinges
dc.typeconference paperes
dc.conference.date2020-11-16
dc.conference.placeFoz do Iguaçu, BRes
dc.conference.titleXLI CILAMCEes
dc.relation.projectCONACYT14-INV-094es
dc.rights.accessRightsopen accesses
dc.subject.ocdeINGENIERIA CIVILes


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