An efficient bond model for particle adhesion simulation in advanced manufacturing

dc.contributor.author	Quintana Ruíz, Osvaldo
dc.contributor.author	Campello, Eduardo
dc.date.accessioned	2022-04-21T01:54:08Z
dc.date.available	2022-04-21T01:54:08Z
dc.date.issued	2020
dc.identifier.uri	http://hdl.handle.net/20.500.14066/2975
dc.description.abstract	The aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes proper adhesion between particles requires certain stability requirements to be satisfied. Conversely, erroneous agglomeration resulting from particle adhesion may affect the particle-size spatial distribution and thereby compromise the mechanical properties of the manufactured piece.	es
dc.description.sponsorship	CONACYT – Consejo Nacional de Ciencia y Tecnología	es
dc.language.iso	eng	es
dc.subject.classification	6 Producción y tecnología industrial	es
dc.subject.other	PARTICLES	es
dc.subject.other	BOND MODEL	es
dc.subject.other	ADHESION	es
dc.subject.other	ADDITIVE MANUFACTURING	es
dc.subject.other	DISCRETE ELEMENT METHODS (DEM)	es
dc.title	An efficient bond model for particle adhesion simulation in advanced manufacturing	es
dc.type	conference paper	es
dc.conference.date	2020-11-16
dc.conference.place	Foz do Iguaçu, BR	es
dc.conference.title	XLI CILAMCE	es
dc.relation.projectCONACYT	14-INV-094	es
dc.rights.accessRights	open access	es
dc.subject.ocde	INGENIERIA CIVIL	es

Artículos científicos
La colección comprende artículos científicos, revisiones y artículos de conferencia que son resultados de actividades científicas y de innovación financiadas por los programas PROCIENCIA y PROINNOVA.