An efficient bond model for particle adhesion simulation in advanced manufacturing
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Date of publishing2020
Type of publicationconference paper
The aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes proper adhesion between particles requires certain stability requirements to be satisfied. Conversely, erroneous agglomeration resulting from particle adhesion may affect the particle-size spatial distribution and thereby compromise the mechanical properties of the manufactured piece.